Production methods and technology
For over 20 years HUNT ENGINEERING performed their own electronic production, to best be able to control the scheduling and quality of the products.
We started performing all electronic assembly by hand using soldering irons, but soon that was not enough for us.
I quickly studied and assessed different electronics production techniques and chose, installed and commissioned a manual production line with stencil printer, pick and place and conveyor based IR re flow machine. We used a water wash technology allowing us to wash the products in a sink. Being a small company with a limited budget I needed to be certain that we were getting value for money and the capabilities that we required.
We used that set up for a long time, through new generations of components and our own products. This included the transition to using BGA packages. There I ran some tests and had X-RAY inspection performed. After some set-up work we continued to produce and ship products with multiple BGAs and a variety of other packages on both sides of the boards.
When the RoHS directive was announced I ran trials of several alternative lead free solder pastes, and before the directive came into force had already determined that the tighter process limits of lead free, combined with our complex products meant that our old IR conveyor technology was no longer sufficient.
Again I embarked on a research mission to find the best and most economical solution for production. This time I chose a small Vapour Phase machine that scientifically guarantees that the lead free process window is achieved across the whole of our complex boards and across all of our products. Now we needed to move to an ultrasonic cleaning system because the lead free water wash process was not good enough for us.
When we developed the HAWK products, we then re-assessed our production systems and techniques and determined that the limit to our capability was the now very old solder stencil printer.
Yet again research was launched, and I quickly found a replacement manual solder stencil machine that held the stencil under tension - allowing a much finer and more accurate printing. Although there were many expensive machines available, the final choice was quite economical - not simply the initial purchase price but also for the manufacture of stencils for each product.
I also designed a system of aluminium board holders that we could mount first on our new stencil printer, but also could then be moved with the board assembly to the pick and place machine and into the vapour phase soldering machine. I made technical drawings of these "nests" and had them made using CNC machines at a local machine shop. Again this was a very economical solution which helped us to achieve high quality and increased throughput.
This experience was gained with a specific set of requirements, and in the electronics industry, but I am equally capable of researching and presenting choices for other types of production.
As with everything I can offer, I can work on this alone, reporting and/or presenting you with your choices and my recommendations, or I can work with your team in an advisory or mentoring capacity.
Contact me to discuss your needs free of charge. If my consulting to you can benefit us both then we can proceed from there.